Article
Three-dimensional acoustic resonators for massively scalable spectral processors - Nature Electronics
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The planar structure of thin-film piezoelectric resonators limits the integration of multiband processors on a single chip. A three-dimensional nanomechanical resonator based on conformal ferroelectric gates to excite resonance in scalable silicon fins is shown to enable multiband integration on a single chip and to facilitate densification of processors for ultrawide-band wireless communication.
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